[{"data": {"name": "Hydrometallurgical Treatment of Waste Printed Circuit Boards: Bromine Leaching", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Hao Cui", "@type": "Person"}, {"name": "Corby Anderson", "@type": "Person"}], "license": "cc-by", "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.mdpi.com/2075-4701/10/4/462/pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "MDPI AG", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.3390/met10040462", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCb1R5jTHUisK-CTTHS4wvBjKr9-CD61C9UiUGRh8-CR45YvGjxHMNg", "propertyID": "ISCC"}], "datePublished": "2020-04-02"}, "schema": "schema.org", "mediatype": "application/ld+json"}]