[{"data": {"name": "The Behavior of Residual Stresses on Epoxy Bonded Structures during Curing Process", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Kazushi HARUNA", "@type": "Person"}, {"name": "Kazuyishi TERAMOTO", "@type": "Person"}, {"name": "Kosuke HARAGA", "@type": "Person"}, {"name": "Ryuji TSUKIDATE", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.jstage.jst.go.jp/article/adhesion/36/9/36_9-5/_pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "The Adhesion Society of Japan", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.11618/adhesion.36.370", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCAzYAENJ3BeR-CTGNKSVN1Cj7w-CD1hksLRQknGi-CRHRsJuu3ZEFk", "propertyID": "ISCC"}], "datePublished": "2000-01-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]