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Core Data

28C4XtJXRUMPT
ISCC-ID - digital asset identifier
CCdxRmabwVtFD-CTAWEgRZeqCfV-CDGHSscRhvYNT-CRAJDWjYa8kaX
ISCC-CODE - digital asset descriptor
2QTa5N4aeSrCB2MLoPdPF4AsTjstJgcLTnd
PUBLIC-KEY or WALLET-ADDRESS of DECLARING PARTY
0
Number of times updated

Seed Metadata (Immutable)

special articles assembly technology trends of smallest thinnest and lightest electronic equipment by thin multilayer boards pac

Ledger Reference

coblo
Source Ledger/Blockchain
12408713
N-th ISCC Decleration on source ledger
708cd7c6fe45e560800783171c224f9ac7b90b5d99d1b2c80294ee3efc533da1
Hash of block that includes the ISCC-DECLARATION
267eab102eaf4e1a1ad42690c562d490458fb7a4c2f734346ea75fd1a75e4858
Hash of transaction that includes the ISCC-DECLERATION
0
Output index that includes ISCC-DECLERATION (UTXO based chains)

Mutable Metadata

[{"data": {"name": "Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Packaging Technology for Mobile Computer.", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Shohgo IDA", "@type": "Person"}, {"name": "Toshihiko NISHIO", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.jstage.jst.go.jp/article/jiep1995/10/1/10_1_36/_pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "Japan Institute of Electronics Packaging", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.5104/jiep1995.10.36", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCdxRmabwVtFD-CTAWEgRZeqCfV-CDGHSscRhvYNT-CRAJDWjYa8kaX", "propertyID": "ISCC"}], "datePublished": "1995-01-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]
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