[{"data": {"name": "Stress-Assisted Shock-Wave-Induced Thin-Film Delamination (SWIFD) of CIGS on a Flexible Substrate", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Pierre Lorenz", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "http://pdfs.semanticscholar.org/ba65/ec800f97fbe0ac7ab4c2ccb342274ba57dcd.pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "Japan Laser Processing Society", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.2961/jlmn.2017.02.0008", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCELMMgTijfHG-CTje3yv1dFTxx-CDH5k4QY1ShW7-CRNXtimLGKrA3", "propertyID": "ISCC"}], "datePublished": "2017-09-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]