[{"data": {"name": "The high-density packaging technologies for large scale computer.", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Makoto Mukai", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.jstage.jst.go.jp/article/jiep1985/4/2/4_2_7/_pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "Japan Institute of Electronics Packaging", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.5104/jiep1985.4.2_7", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCdfxGGZnNDem-CTfNApSQ9X1fw-CD7zoz3tmp7SQ-CRK1fLnSaa2iQ", "propertyID": "ISCC"}], "datePublished": "1988-01-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]