[{"data": {"name": "Development of Electroplated Diamond Saw Wire by Novel Electroplating Technique", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Tsunehisa SUZUKI", "@type": "Person"}, {"name": "Jun-ichi MURAOKA", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.jstage.jst.go.jp/article/jjspe/83/9/83_820/_pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "Japan Society for Precision Engineering", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.2493/jjspe.83.820", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCbBDruAAgvjW-CTAKdQ3TP42ts-CDja4jyyhnfkD-CRc8g9qs9bsbh", "propertyID": "ISCC"}], "datePublished": "2017-01-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]