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Core Data

28CrZtYLAvP1H
ISCC-ID - digital asset identifier
CCiwEndBZWGBp-CTKag5ByXh9qK-CDDHRR22S28q8-CRFEtq2qibctV
ISCC-CODE - digital asset descriptor
2QTa5N4aeSrCB2MLoPdPF4AsTjstJgcLTnd
PUBLIC-KEY or WALLET-ADDRESS of DECLARING PARTY
0
Number of times updated

Seed Metadata (Immutable)

planarization polishing technique for large diameter of bare silicon wafer

Ledger Reference

coblo
Source Ledger/Blockchain
26235
N-th ISCC Decleration on source ledger
4341f787d3fff8eb1797004f2314349a2c28f4e548905621fdf50b15b30bce03
Hash of block that includes the ISCC-DECLARATION
971ddc1b0ce91ab16464baced41b49a415a575be19171286fac53f1ec4c2b435
Hash of transaction that includes the ISCC-DECLERATION
0
Output index that includes ISCC-DECLERATION (UTXO based chains)

Mutable Metadata

[{"data": {"name": "Planarization Polishing Technique for Large Diameter of Bare Silicon Wafer", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Hatsuyuki ARAI", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.jstage.jst.go.jp/article/jjspe/73/7/73_7_756/_pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "Japan Society for Precision Engineering", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.2493/jjspe.73.756", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCiwEndBZWGBp-CTKag5ByXh9qK-CDDHRR22S28q8-CRFEtq2qibctV", "propertyID": "ISCC"}], "datePublished": "2007-01-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]
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