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Core Data

28CrmRrV7bEGV
ISCC-ID - digital asset identifier
CCGfZ6SYpHTUT-CTLWvMsCt47u4-CDHyrgCaBzzXF-CRPsXUvsYxKBc
ISCC-CODE - digital asset descriptor
2QTa5N4aeSrCB2MLoPdPF4AsTjstJgcLTnd
PUBLIC-KEY or WALLET-ADDRESS of DECLARING PARTY
0
Number of times updated

Seed Metadata (Immutable)

the sprint process of al interconnects with lowtemperature pvd via filling

Ledger Reference

coblo
Source Ledger/Blockchain
6189
N-th ISCC Decleration on source ledger
78724e47c55b1e8490e87a63001bbb30f1b7b1d0acf52f6e7b62afdb93a6fa30
Hash of block that includes the ISCC-DECLARATION
2ad9ffdb057afb99623076cf66250d5957b574188825d1602decc86f33ce190d
Hash of transaction that includes the ISCC-DECLERATION
0
Output index that includes ISCC-DECLERATION (UTXO based chains)

Mutable Metadata

[{"data": {"name": "The sprint process of Al interconnects with low-temperature PVD via filling", "@type": "ScholarlyArticle", "genre": "journal-article", "author": [{"name": "Takashi Yoda", "@type": "Person"}, {"name": "Hirokazu Ezawa", "@type": "Person"}, {"name": "Kaori Tsutsumi", "@type": "Person"}, {"name": "Makoto Honda", "@type": "Person"}], "@context": "http://schema.org/", "encoding": [{"@type": "MediaObject", "contentUrl": "https://www.jstage.jst.go.jp/article/elex/1/9/1_9_263/_pdf", "encodingFormat": "application/pdf"}], "publisher": {"name": "Institute of Electronics, Information and Communications Engineers (IEICE)", "@type": "Organization"}, "identifier": [{"@type": "PropertyValue", "value": "10.1587/elex.1.263", "propertyID": "DOI"}, {"@type": "PropertyValue", "value": "CCGfZ6SYpHTUT-CTLWvMsCt47u4-CDHyrgCaBzzXF-CRPsXUvsYxKBc", "propertyID": "ISCC"}], "datePublished": "2004-01-01"}, "schema": "schema.org", "mediatype": "application/ld+json"}]
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